While Covid-19 has forced the cancellation of tradeshows and conferences around the world, our product development team hasn’t slowed at all. Over the last six months, we’ve introduced dozens of new imaging components, driving significant advances in key industrial vision segments; including machine learning and AI; extreme high-resolution and high-speed imaging; 3D sensing; multi-spectral imaging; and high-volume, low-cost CMOS sensors.
Please join us for this multi-session, virtual event to learn about the newest and most innovative imaging solutions from Teledyne.
Clarity at High Speed – Performance Imaging
Tuesday, November 17, 2020 – 9:00 AM (ET)
Discover how our newest area and line scan technology can improve defect detection, reduce lighting and lens costs, and help reduce takt time. Learn how to capture several images at once from independent light sources with multi-array technology, and the newest advances in frame grabber technology with multi-camera inputs. High performance, cost-effective solutions for today’s most demanding imaging challenges.
Speakers: Xing-Fei He – Senior Product Manager, Teledyne DALSA; Mark Butler – Business Analyst, Teledyne DALSA
Connection is Everything – Camera/Data Interfaces
Tuesday, November 17, 2020 – 10:30 AM (ET)
This session will highlight the pros and cons of multiple data interfaces including GigE Vision (1GigE, 5GigE), USB3 Vision, CoaXPress (CXP), Camera Link, and Camera Link HS, with examples from our comprehensive portfolio of area scan cameras. See our newest products leveraging the newest interfaces such as Teledyne e2v MIPI optical modules, Lt Series USB3 board level cameras, and Genie Nano cameras in 5GigE and CXP-12 versions including frame grabbers.
Speakers: Manny Romero – Senior Product Manager, Teledyne DALSA; Eric Carey – Vice President of R&D, Teledyne DALSA
AI & Embedded Vision – Driving System Innovation
Wednesday, November 18, 2020 – 9:00 AM (ET)
Learn about the benefits of AI over traditional image processing and how it can solve challenging problems. The latest Sapera™ Vision Software suite includes Sapera Processing and the new Astrocyte™ graphical application for training neural networks. Learn how users can bring in their own image samples and train neural networks to perform classification, object detection, segmentation and noise reduction in their own applications. Learn about advances in embedded vision along with the newest AI capabilities.
Speaker: Bruno Menard – Software Director, Teledyne DALSA
New Advances in 3D Sensing
Wednesday, November 18, 2020 – 10:30 AM (ET)
Learn what advances in sensor quality and speed, embedded systems, FPGAs, lasers, optics, and smart systems are driving into 3D scanning and measurement. Gain insight into solving practical applications with Hydra, our new ToF CMOS image sensor, delivering reliable 3D detection of fast-moving scenes to enable real-time decision-making. See how Teledyne is combining image sensor speed, accurate algorithms, and easy-to-use software to solve challenging in-line 3D inspection, detection and measurement applications on the factory floor using our next generation Z-Trak 3D profile sensors.
Speakers: Inder Kohli – Senior Product Manager, Teledyne DALSA; Ha Lan Do Thu – Marketing Manager, Teledyne e2v; Sergio Morillas – Business Manager, Teledyne e2v
Beyond Sight! Non-Visible and Multi-Spectral Imaging
Thursday, November 19, 2020 – 9:00 AM (ET)
This session will highlight advancements in extra-visible imaging (X-ray, ultraviolet, shortwave IR, and longwave IR plus combinations). Learn how SWIR and LWIR imaging can reveal the non-visible, performing critical inspections in food sorting and temperature detection. Subject matter experts will speak on the combination that visible and IR bring. Plus, you’ll learn about the latest in multispectral filter technologies, including advancements in polarization, hyperspectral and multi-band imaging.
Speakers: Mike Grodzki – Product Manager, Teledyne DALSA; Jean Brunelle – Product Manager, Teledyne DALSA
Evolving CMOS Sensor Technology
Thursday, November 19, 2020 – 10:30 AM (ET)
This technology session will examine state-of-the art CMOS sensor technology and how these innovations are impacting imaging. Review the latest pixel and ADC structures, 3D-stacking, chip-stacking, nano-imprinting and onboard processing, as well as new techniques in packaging and interfaces, and discover how these increase performance while reducing size and power, unlocking new and exciting applications for imaging. See the benefits of these innovations in the field using our newest Snappy and Emerald series sensors as well as our latest MIPI optical module.
Speakers: Florian Julien – Business Manager, Teledyne e2v; Marie-Charlotte Leclerc – Product Manager, Teledyne e2v